Abstract: As a highly integrated electronic device, prolonged operation of face recognition attendance machines can lead to elevated temperatures in the internal main control chip, thereby affecting recognition accuracy and device lifespan. This study investigates the thermal dissipation issues of face recognition attendance machines through thermal source analysis and thermal simulation modeling. First, a three-dimensional model was established using SOLIDWORKS software to analyze the heat generation characteristics of the main control chip, camera module, and power supply module. Subsequently, ANSYS ICEPAK software was employed to simulate the temperature distribution within the device. Next, a thermal dissipation solution based on optimized airflow channels and aluminum alloy materials was proposed, and its effectiveness was compared with natural cooling and traditional PC materials. Simulation results demonstrate that the optimized thermal structure reduces the main control chip temperature by 13.9%, with only an 8% increase in cost, significantly enhancing device stability. This study provides theoretical foundations and simulation references for low-cost thermal design in compact electronic devices. While the findings are validated through simulations, future work will require physical testing to further verify the engineering applicability of the proposed solution.