CuCr合金热处理工艺研究

Study on heat treatment process of CuCr alloy

  • 摘要: 为满足企业对简化处理工艺的需求,实现CuCr合金高强高导的综合性能,本文研究了不同固溶和时效工艺对热轧态CuCr合金的影响规律。通过对CuCr合金在800-1000 ℃不同固溶温度和500 ℃下1−6 h不同时效时间的试验研究,分析了其显微组织、硬度与电导率的变化规律。结果表明:固溶处理后Cr以富Cr相析出,固溶+时效处理后以Cr单质析出,细小弥散的析出相可提高强度,粗化后则综合性能变差;随着固溶温度升高,硬度持续上升,1000 ℃时达124.33 HV,电导率则呈现出先降后升趋势,950 ℃时达峰值87.67% IACS;电导率在时效5 h时达最大89.16%IACS,硬度4 h时达最大114.5 HV,后期均开始降低。工艺为950 ℃固溶+500 ℃时效4 h时,试样硬度为100.71 HV、电导率为85.61%IACS,达到最优综合性能。此结果为企业提供了一条低成本、易实施的工艺路径,也为同类铜合金的开发与工艺优化提供了新思路。

     

    Abstract: To meet the demand of enterprises for simplified processing and achieve the comprehensive properties of high strength and high conductivity in CuCr alloys, this study investigated the effects of different solution and aging treatments on hot-rolled CuCr alloys. Through experimental research on CuCr alloys subjected to solution treatments at temperatures ranging from 800–1000 ℃ and aging treatments at 500 ℃ for durations of 1–6 hours, the variations in microstructure, hardness, and electrical conductivity were analyzed. The results show that after solution treatment, Cr precipitates as Cr-rich phases, while after solution and aging treatments, it precipitates as elemental Cr. Fine and dispersed precipitates can enhance strength, whereas coarsening leads to deteriorated comprehensive properties. With increasing solution temperature, the hardness continuously rises, reaching 124.33 HV at 1000 ℃, while the electrical conductivity first decreases and then increases, peaking at 87.67% IACS at 950 ℃. The electrical conductivity reaches its maximum of 89.16% IACS after 5 hours of aging, and the hardness reaches its peak of 114.5 HV after 4 hours of aging, after which both begin to decline. The optimal comprehensive properties are achieved with a hardness of 100.71 HV and an electrical conductivity of 85.61% IACS under the process conditions of solution treatment at 950 ℃ followed by aging at 500 ℃ for 4 hours.This finding delivers a low-cost, readily implementable process route for enterprises, and further provides novel insights into the development and process optimization of analogous copper alloys.

     

/

返回文章
返回