Thermal Analysis and Optimization Design of Board-Level Circuit based on Icepak

To address the heat dissipation issue of a certain multi chip circuit board,a thermal simulation model of the circuit board was established using Icepak thermal analysis software to obtain the temperature distribution of the circuit board.The accuracy of the simulation results was verified by measuring the working temperature of the circuit board through a high and low temperature testing system.A comparative analysis was conducted on the temperature distribution of the circuit board when considering heat dissipation measures,the results showed that after adding heat dissipation measures,the working temperature of the circuit board significantly decreased,ensuring the reliability of the circuit board's operation and shortening the product design cycle,providing a reference for the development of board level circuits.